{
 "generated": "2026-11-01",
 "node": {
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  "type": "Organization",
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  "org_type": "Developer",
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  "at": "2026-10-29T04:41:11Z",
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    "map_title": "AI 算力产业链",
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    "role": "primary"
   },
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    "map_title": "芯片设计全流程",
    "card": "player-siemens-calibre",
    "title": "Siemens EDA Calibre 全套ML",
    "layer": "物理验证 DRC/LVS/DFM",
    "layer_id": "layer:chip-design-flow--8",
    "role": "mention"
   }
  ],
  "landscape_maps": [
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   "compute-industry"
  ],
  "landscape_n": 2,
  "degree": 0,
  "n_apps": 0,
  "n_models": 0
 },
 "page": "https://xiaopingfeng.com/graph/e/org/tsmc/",
 "out": [
  {
   "type": "placed_in",
   "sentence": "TSMC出现在 Landscape 的「代工 / 先进封装」",
   "direction": "out",
   "id": "layer:compute-industry--2",
   "name": "代工 / 先进封装",
   "reported": false,
   "status": "derived",
   "evidence": [
    {
     "kind": "own",
     "label": "本站页面",
     "text": "Landscape「AI 算力产业链」第 02 层「代工 / 先进封装」：卡片「台积电（TSMC）」",
     "url": "https://xiaopingfeng.com/landscape/compute-industry/#player-tsmc"
    }
   ]
  }
 ],
 "in": []
}