{
 "generated": "2026-11-06",
 "sha": "78bbd39a8828",
 "node": {
  "id": "org:unimicron",
  "type": "Organization",
  "name": "Unimicron（欣兴电子）",
  "org_type": "Developer",
  "kind": "company",
  "homepage": "https://www.unimicron.com/",
  "note": "PCB 与 IC 载板",
  "aliases": [
   "Unimicron Technology",
   "欣興電子",
   "欣兴电子",
   "欣兴"
  ],
  "entry": "agent",
  "by": "ep110-graph-1106",
  "at": "2026-11-05T22:59:26Z",
  "landscape": [
   {
    "map": "compute-industry",
    "map_title": "AI 算力产业链",
    "card": "player-unimicron",
    "title": "欣兴电子（Unimicron）· 基板与 PCB",
    "layer": "基板与封测产能",
    "layer_id": "layer:compute-industry--9",
    "role": "primary",
    "url": "/graph/e/layer/compute-industry--9/#player-unimicron"
   }
  ],
  "landscape_maps": [
   "compute-industry"
  ],
  "landscape_n": 1,
  "degree": 0.0008,
  "n_apps": 0,
  "n_models": 0,
  "covered_eps": [
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  ],
  "n_covered_eps": 1,
  "covered_first": 110,
  "covered_last": 110,
  "n_covered_stories": 1,
  "n_covered_items": 0
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 "page": "https://xiaopingfeng.com/graph/e/org/unimicron/",
 "out": [
  {
   "type": "supplies_to",
   "sentence": "Unimicron向NVIDIA供应产品或服务",
   "direction": "out",
   "id": "org:nvidia",
   "name": "NVIDIA",
   "since": "2026-10-21",
   "note": "NVIDIA 以产能预订协议支持欣兴在台湾的 KF 基板扩产；新增产能预计 2027 年第二季度起、2028 年中达到满产。日期为新闻稿日期",
   "product": "KF 基板",
   "status": "agent",
   "evidence": [
    {
     "kind": "official",
     "label": "官方页面",
     "text": "NVIDIA 2026-10-21 新闻稿：NVIDIA is supporting Unimicron's KF substrate manufacturing expansion in Taiwan with a capacity reservation agreement",
     "url": "https://nvidianews.nvidia.com/news/nvidia-and-supply-chain-partners-expand-capacity-to-accelerate-ai-infrastructure-buildout"
    }
   ]
  },
  {
   "type": "placed_in",
   "sentence": "Unimicron出现在 Landscape 的「基板与封测产能」",
   "direction": "out",
   "id": "layer:compute-industry--9",
   "name": "基板与封测产能",
   "reported": false,
   "status": "derived",
   "evidence": [
    {
     "kind": "own",
     "label": "本站页面",
     "text": "Landscape「AI 算力产业链」第 09 层「基板与封测产能」：卡片「欣兴电子（Unimicron）· 基板与 PCB」",
     "url": "https://xiaopingfeng.com/graph/e/layer/compute-industry--9/#player-unimicron"
    }
   ]
  }
 ],
 "in": [
  {
   "type": "covers",
   "sentence": "未来的硬件是怎么造出来的：一句话就能画出板子，真正排队的是材料、产能和验证讲到Unimicron",
   "direction": "in",
   "id": "story:110-story-c",
   "name": "未来的硬件是怎么造出来的：一句话就能画出板子，真正排队的是材料、产能和验证",
   "role": "mention",
   "status": "agent",
   "evidence": []
  }
 ]
}