{
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  "order": 2,
  "head": "先进封装（而非晶圆）是2026年公认的真正瓶颈。",
  "text": "先进封装（而非晶圆）是2026年公认的真正瓶颈。 台积电CoWoS产能一年内近乎翻两番仍供不应求，倒逼首次大规模外包给日月光/矽品。",
  "page": "/graph/e/map/compute-industry/#trends",
  "degree": 0
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   "direction": "out",
   "id": "map:compute-industry",
   "name": "AI 算力产业链",
   "status": "derived",
   "evidence": [
    {
     "kind": "own",
     "label": "本站页面",
     "text": "Landscape「AI 算力产业链」的「最近的关键变化」第 2 条",
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   "type": "mentions",
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   "id": "org:tsmc",
   "name": "TSMC（台积电）",
   "status": "derived",
   "evidence": [
    {
     "kind": "own",
     "label": "本站页面",
     "text": "名称匹配：「台积电」出现在 Landscape「AI 算力产业链」的页面判断里",
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